JPS5228134Y2 - - Google Patents
Info
- Publication number
- JPS5228134Y2 JPS5228134Y2 JP1969472U JP1969472U JPS5228134Y2 JP S5228134 Y2 JPS5228134 Y2 JP S5228134Y2 JP 1969472 U JP1969472 U JP 1969472U JP 1969472 U JP1969472 U JP 1969472U JP S5228134 Y2 JPS5228134 Y2 JP S5228134Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1969472U JPS5228134Y2 (en]) | 1972-02-17 | 1972-02-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1969472U JPS5228134Y2 (en]) | 1972-02-17 | 1972-02-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4896447U JPS4896447U (en]) | 1973-11-16 |
| JPS5228134Y2 true JPS5228134Y2 (en]) | 1977-06-27 |
Family
ID=27872619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1969472U Expired JPS5228134Y2 (en]) | 1972-02-17 | 1972-02-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5228134Y2 (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1989008374A1 (en) * | 1988-02-26 | 1989-09-08 | Fujitsu Limited | Substrate for mounting optical parts and electric circuitry parts and method of producing the same |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6211014Y2 (en]) * | 1986-01-16 | 1987-03-16 | ||
| JP3779721B1 (ja) * | 2005-07-28 | 2006-05-31 | 新神戸電機株式会社 | 積層回路基板の製造方法 |
-
1972
- 1972-02-17 JP JP1969472U patent/JPS5228134Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1989008374A1 (en) * | 1988-02-26 | 1989-09-08 | Fujitsu Limited | Substrate for mounting optical parts and electric circuitry parts and method of producing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4896447U (en]) | 1973-11-16 |